Knowledge of current mounting and connection technologies of electronic systems. Knowledge of production, assembly and testing technologies, basic knowledge og assembly techniques of all common technologies, basic knowledge of DFX (manufacturing, quality) techniques.
Objectives:
The bottleneck to increased systems performance is now more the package than the chip. Multi Chip Modules, SOS, etc. are todays solutions for electronic packaging.
Course contents:
Circuit board technologies, Chip mounting technologies, manufacturing processes of Multi Chip Modules; Technologies like SOS etc. Design to cost, Design for Manufacturing aspects
Literature:
Philip E. Garrou. Iwona Turlik, Muliti Chip Module Technology Handbook, MC Graw Hill,
Clyde, F. ; Commbs, JR., Printed Circuit Handbook, MC Graw Hill, 5. Edition
Garrou, Philip E.; Mutlichip Modules Technology Handbook, Mc Graw Hill, ISBN 0-07-022894-9
Lau, John H.; Chip on Board, Van Nostrand Reinhold, ISBN 0-442-01441
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